SIITME 2026

Between October 28 and 31, 2026, Valahia University of Târgoviște will host the 32nd edition of the IEEE International Symposium for Design and Technology in Electronics Packaging (SIITME 2026), to be held at the Institute of Multidisciplinary Research for Science and Technology (ICSTM). The symposium is organised by the SIITME Steering Committee, in agreement with IEEE and the IEEE Hungary & Romania EPS&NTC Joint Chapter.

Held annually since 1995, SIITME brings together researchers, academics, engineers, PhD students, and students from academia and industry who are interested in the design, technology and reliability of electronic systems.

This year’s programme includes invited lectures by experts from universities and industry, oral and poster sessions, and industrial sessions, as well as a technology exhibition where companies in the field will present their solutions. The presented papers are submitted for inclusion in the IEEE Xplore database.

For Valahia University, which serves as the Local Organising Committee, hosting SIITME represents an opportunity to strengthen the links between research, industry and the student community. The symposium will be preceded, on October 27, by the 5th edition of the IEEE EPS & NTC Student Branch Chapters Summit.

The full programme and participation details are available on the conference website: siitme.ro.